This deliverable demonstrates the full-module strings with low PCE loss induced by the interconnection of the cells. “Full-module string” means the interconnection of a number of full-size wafers as can be used in a full-size module. In order to achieve the target, the interconnection mode has to be defined, a potential module design needs to be chosen, and the actual module fabrication process needs to be optimized to achieve the target. During process development, several different topics have been addressed by PEPPERONI partners, including wire/cell alignment accuracy, wire pre-treatment, cell format compatibility, accurate bonding process control, Low Temperature Interconnection material screening as well as Low Temperature Interconnection process development.